Server

AMD EPYC™ 9004 series Processors System on Chip Up to 3TB 3DS ECC RDIMM, DDR5-4800MHz in 12 DIMM slots 3 PCIe 5.0 x16 2 PCIe 5.0 x8 2x 10GBase-T LAN Ports via Broadcom BCM57416 Up to 6 USB 3.0 ports(4 rear + 2 via header) 8 SATA3 ASPEED AST2600 BMC graphics 6 PWM 4-pin Fans with tachometer status monitoring M.2 Interface: 2 PCIe 4.0 x4 M.2 Form Factor: 2280, 22110

Intel® Xeon® 6700-series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots 6 PCIe 5.0 x8 via MCIO connectors 3 PCIe 5.0 x16, 3 PCIe 5.0 x8, M.2 Interface: 2 PCIe 5.0 x2 M.2 Form Factor: 22110

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 4. Riser card support: Left side - 1 PCI-E 3.0 x32

2nd Generation Intel® Xeon® Scalable Processors (Cascade Lake-SP), Single Socket P (LGA 3647) supported, CPU TDP support 205W Up to 1.5TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 1.5TB 3DS ECC LRDIMM, DDR4-2933MHz, in 6 DIMM slots Intel® C622 chipset

8th Generation Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium®, Intel® Xeon® E processor (Coffee Lake-S) Server, Intel® Xeon® E processor (Coffee Lake-S) Workstation., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP Intel® C246 Up to 64GB Unbuffered ECC/non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x16 slot), 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1, 2 PCI-Ex16 slots are running at NA/16, or 8/8 1 PCI, 1 - 5V PCI 32bit M.2 Interface: 2 PCI-E 2.0 x4, RAID 0 & 1 M.2 Form Factor: 22110 M.2 Key: M-Key M.2#1~2 are shared with SATA #6~7, M.2#2 is shared with U.2 U.2 Interface: 1 PCI-E 3.0 x4 1 HDMI port, 1 DVI - I port, 1 DP (DisplayPort) port, HDMI is HDMI2.0a, DP is DP1.2, Intel® C246 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Single LAN with Intel® Ethernet Controller I210-AT Single LAN with Intel® PHY I219LM LAN controller Support vPro

1. Intel® Xeon® 6700E-series, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP 2. Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots 3. 4 PCIe 5.0 X8 via MCIO connectors 4. Dual LAN with 1GbE with Intel®I210 5. Onboard TPM2.0

Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v3/v4 family; UPI up to 9.6GT/s Intel® C612 chipset Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz; 16 DIMM slots 3 PCI-E 3.0 x16 and 3 PCI-E 3.0 x8 Intel® i350 Dual port GbE LAN 10 SATA3 (6Gbps); RAID 0, 1, 5, 10

Intel® Xeon® Scalable Processors, Single Socket P (LGA 3647) supported, CPU TDP support 165W, Intel® C621 Chipset, Up to 768GB ECC 3DS LRDIMM, up to DDR4-2666MHz; 6x DIMM slots

1S Intel Sapphire Rapids CPU 12" x 10.5" CEB Form Factor 8 DIMM slots with DDR5 4800 memory support 4 PCIe 5.0 x16 + 1 PCIe 5.0 x4 slots 1 MCIO 8x conn. (NVMe) 1 NVMe M.2 2280 slot (PCIe 3.0 x4) 2 10GBase-T LAN + 1 1000Base-T + 1 dedicate 1000Base-T IPMI ports AST2600 BMC with IPMI 2.0 & Redfish support

Single socket H3 (LGA 1150) supports Intel® Xeon® E3-1200 v3/v4, 4th gen. Core i3, Pentium, Celeron processors Intel® C222 Express PCH Up to 32GB DDR3 ECC 1600MHz UDIMMs in 4 sockets Intel® i210T dual port GbE LAN 2 SATA (6Gbps), 4 SATA (3Gbps)

4th Gen Intel® Xeon® Scalable processors, Single Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP Intel C741® Chipset Up to 2TB 3DS ECC RDIMM, DDR5-4800MT/s (1DPC) in 8 DIMM slots 1 PCIe 5.0 x8, 2 PCIe 5.0 x16, 8 PCIe 5.0 NVMe x4 Internal Port(s)

1. Single socket H3 (LGA 1150) supports Intel® Xeon® E3-1200 v3/v4, 4th gen. Core i3, Pentium, Celeron processors 2. Intel® C224 Express PCH 3. Up to 32GB DDR3 ECC 1600MHz UDIMMs in 4 sockets