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1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8

1. Dual Node Twin Architecture, 2x compute Each node controls 30 drives 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 60x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 160W TDP) 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 4. SIOM for flexible networking options 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays; 2 rear Hot-swap 2.5" SATA drive bays; optional 6 NVMe bays 6. Broadcom 3008 SAS3 IT mode controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5 hot-swap 8cm redundant PWM fans PWM fans 9. 1600W Redundant Power Supplies Platinum Level (94%+) Certified 10. Front 3.5" LCD display

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots 3. 2 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8 + x8 for SAS3

1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 24 Hot-swap 2.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 8x 40mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 2 PCI-E 3.0 x8 (in x16), 4 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2 GbE LAN ports via Intel i210 5. 45 Hot-swap 3.5" SAS3/SATA3 drive bays, 2 rear Hot-swap 2.5" SATA drive bays; optional 2 SATA or NVMe 6. Broadcom 3108 SAS3, HW RAID (AOC-S3108L-H8IR-P ) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 5 Hot-swap 8cm redundant PWM fans 9. 1600W Redundant Power Supplies Platinum Level

1. Dual Node (HA), Enterprise High Availability (SBB) Architecture (shared storage); Fully serviceable and redundant Two hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following: 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 IT Mode 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2600W Redundant Power Supplies Titanium Level (96%) 10. Dedicated node to node connectivity featuring high performance NTB PCI-E 3.0 x16 , 1G private Ethernet, and IPMI for robust node fail-over support

1. High Availability Storage Appliance Platform 2. Redundant Hot-swap expander trays 3. 4 SAS3.0 IO ports 4. 24 Hot-swap 3.5" Drive Bays 5. IPMI 2.0 with dedicated LAN 6. 4x 40mm and 4x 80mm cooling fans 7. 1200W Redundant Power Supplies Titanium Level Certified

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1x PCI-E 3.0 x16, 6x PCI-E 3.0 x8 4. Dual 10GBase-T LAN w/ Intel® X540

1. Single Node High density, 2 rear mirrored boot drives, 4 NVMe SSD drives for caching 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 (HHHL), 1 PCI-E 3.0 x8 (HHHL) 5. 90x 3.5"/2.5" Hot-swap SAS3/SATA3 drives, 2x Fixed slim SATA SSD, 2x NVMe M.2 (form factor: 22110) 6. Dual Broadcom 3616 controllers (IT Mode) or Broadcom 3916 (H/W RAID) 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 6x 8cm hot-swap counter-rotate redundant PWM cooling fans 9. 2000W Redundant Power Supplies Titanium Level (96%)

1. Intel® Xeon® processor D-1518, Single socket FCBGA 1667; 4-Core, 8 Threads, 35W 2. 12x 3.5" SAS2/SATA3 Hot-swap HDD bays 3. Expansion slot: 1x PCI-E 3.0 x8, M.2 PCIe 3.0 x4, M Key 2242/2280/ 22110, Mini-PCIe w/ mSATA support